Highly Virtual Prototyping:
Device Thermal Performance
Make a difference with a value chain that develops smart, connected, secure electronic systems. We enable you to bring high-tech products to the market in a fast and sustainable way.
3DEXPERIENCE | My3DEXPERIENCE
Highly Virtual Prototyping
Ensure optimal product performance and reduce warranty costs with an end-to-end solution for thermal management of electronic systems
With the Device Thermal Performance process, users will be able to:
- Manage component-level heat dissipation and thermal stresses from electronic assemblies in a unified multi-scale, multi-physics environment
- Identify optimal sizing and placement of components (fans, vents, heat sinks, etc.) under packaging constraints
- Explore and deploy active and/or passive cooling strategies with seamless integration between 3D design, thermal structural and fluid dynamics simulation, enabling updated performance prediction in minutes
- Perform trade-off studies and parametric optimization of electronic systems by deploying automated design of experiments analysis
All Roles for Device Thermal Performance
Explore all roles for Dassault Systèmes’ High-Tech: Highly Virtual Prototyping processes. Integrate into the 3DEXPERIENCE Platform!
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